Narrative
Full Description
Project narrative
On June 2, 2011, ICBC entered into a $24.7 million USD loan agreement with Hoku Corporation — a now-defunct Idaho-based clean energy company that specialized in polysilicon production for solar panels — to support the company’s continued project development and corporate financing needs. The proceeds were used by the borrower for general corporate purposes, particularly in relation to the construction and advancement of its polysilicon manufacturing facility in Pocatello, Idaho. The maturity of the loan is the earlier of June 2, 2016 or the tenth business day prior to the expiration or termination of the standby letter of credit. The interest rate is LIBOR plus 3.8%. The loan was fully secured by a standby letter of credit with a drawable amount of $30.1 million USD, issued by the Sichuan Branch of ICBC and procured by Tianwei in favor of ICBC’s New York Branch. Hoku also entered into a reimbursement agreement with Tianwei, agreeing to repay all interest, fees, and expenses related to the issuance and performance of the standby letter of credit. The full $24.7 million USD was disbursed in June 2011.
Staff comments
1. The entirety of the loan agreement is not available. However, Form 10-K from the company is available for descriptions of the loan. It can be accessed at https://getfilings.com/sec-filings/110715/HOKU-SCIENTIFIC-INC_10-K/. 2. Hoku Corporation was a U.S.-based clean energy company headquartered in Pocatello, Idaho. It began in fuel cell technology before transitioning to solar manufacturing. In 2009, it became majority-owned by China’s Tianwei New Energy Holdings. Hoku declared bankruptcy in 2013, and its assets were liquidated. 3. AidData estimates the interest rate by adding the margin (2%) to 6 months LIBOR.