Bank of China provides loan worth 78.8 million lei to Moldtelecom for technological upgrades (Linked to Project IDID#66611, ID#66614, ID#66617)

In 2010, the Bank of China issued a loan worth 78.8 million Lei to Moldtelecom — a state-owned telecommunications operator — to facilitate its acquisition of telecommunications (3G) equipment and post-warranty services from Huawei. The borrowing terms of the loan are unknown. By the end of 2010, Huawei and Bank of China had collectively lend Moldtelecom 236.8 million lei, which was equivalent to 30.8% of all of the outstanding debt obligations of Moldtelecom (as compared to 148.6 million lei in 2009).

Additional details

1. Bank of China issued two separate loans to Moldtelecom in 2010. The other loan is captured in Project ID#66617. 2. The loan was part of a larger package of loans and supplier credits that Bank of China and Huawei issued to Moldtelecom (see Project ID#66611, ID#66614, ID#66617).

Number of official sources

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Number of total sources

1